Hacker News with Generative AI: Semiconductor Manufacturing

TSMC cannot make 2nm chips abroad now: MOEA (taipeitimes.com)
Taiwan’s technology protection rules prohibits Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) from producing 2-nanometer chips abroad, so the company must keep its most cutting-edge technology at home, Minister of Economic Affairs J.W. Kuo (郭智輝) said yesterday.
TSMC rumored to receive High NA EUV machines from ASML this year (tomshardware.com)
TSMC in tussle with golf course to build most advanced 2nm chip plant on planet (tomshardware.com)
TSMC Arizona fab delivers 4% more yield than comparable Taiwan facilities (tomshardware.com)
TSMC Arizona achieves production yields similar to those at its fabs in Taiwan (tomshardware.com)
TSMC's Arizona Trials Put Plant Productivity on Par with Taiwan (bloomberg.com)
Imec demonstrates logic and DRAM structures using High NA EUV Lithography (imec-int.com)
Pulsed laser deposition at wafer level is a game changer (eetimes.com)
TSMC experimenting with rectangular wafers vs. round for more chips per wafer (nikkei.com)
Secret meeting between Apple and TSMC reported to reserve all 2nm capacity (9to5mac.com)
TSMC says can make next generation chips without ASML's new machine (reuters.com)
TSMC Unveils Advanced 1.6nm Process for 2026 Chips (macrumors.com)
Intel's 14A Magic Bullet: Directed Self-Assembly (DSA) (semianalysis.com)
TSMC Plans to Put a Trillion Transistors on a Single Package by 2030 (techpowerup.com)