Ultraprecise method of aligning 3D semiconductor chips invented
(techxplore.com)
Researchers at the University of Massachusetts Amherst have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram.
Researchers at the University of Massachusetts Amherst have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram.