Ultra-thin cooling solution for mobile devices unlocks slimmer technology
(techxplore.com)
Scientists from Nagoya University in Japan have developed an innovative cooling device—an ultra-thin loop heat pipe—that significantly improves heat control for electronic components in smartphones and tablets.
Scientists from Nagoya University in Japan have developed an innovative cooling device—an ultra-thin loop heat pipe—that significantly improves heat control for electronic components in smartphones and tablets.