No Time Like MEMS Time
(morethanmoore.substack.com)
The next generation of high performance processors are really kicking it up a notch. We’ve moved from 300 W to 600 W and now we’re looking at 1200 W+ designs quickly coming down the pipe. TSMC published research a couple of years ago about how to cool these monsters up to 2600 W, and IBM has a lot of patents on intra-die-stacked cooling from the mid-2000s.
The next generation of high performance processors are really kicking it up a notch. We’ve moved from 300 W to 600 W and now we’re looking at 1200 W+ designs quickly coming down the pipe. TSMC published research a couple of years ago about how to cool these monsters up to 2600 W, and IBM has a lot of patents on intra-die-stacked cooling from the mid-2000s.