Two-phase chip cooling with manifold-capillary structures enables 10⁵ COP
(sciencedirect.com)
The exploration of two-phase flow and heat transfer within confined spaces has revealed its potential to mitigate formidable heat dissipation in various applications, such as thermal management in advanced electronic devices.
The exploration of two-phase flow and heat transfer within confined spaces has revealed its potential to mitigate formidable heat dissipation in various applications, such as thermal management in advanced electronic devices.