Copper evolution and beyond: Advanced interconnects for future CMOS nodes
(research.ibm.com)
Even after 27 years, IBM’s innovation in introducing Cu (copper) damascene technology for BEOL (Back-End-of-Line) in CMOS semiconductor production remains the industry standard for high-performance and low-power logic integrated circuit chip manufacturing.
Even after 27 years, IBM’s innovation in introducing Cu (copper) damascene technology for BEOL (Back-End-of-Line) in CMOS semiconductor production remains the industry standard for high-performance and low-power logic integrated circuit chip manufacturing.